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solderless compression interconnect CINCH 3180299352 designed for easy installation and maintenance

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solderless compression interconnect CINCH 3180299352 designed for easy installation and maintenance

Product Overview

CIN::APSE is a high-density, solderless Z-axis compression interconnect technology designed for board-to-board, IC-to-board, flex-to-board, and component-to-board applications. This crimpless interconnect offers exceptional mechanical and electrical performance, supporting signal speeds well above 50 Gbps. Its unique, patent-protected 2-piece design utilizes randomly wound, gold-plated molybdenum wire contacts that ensure multiple points of contact per I/O, providing proven reliability under extreme mechanical shock and vibration. The solderless termination achieved through compression allows for quick installation without soldering, reducing the risk of damaging components and enabling easy repairs and upgrades. CIN::APSE is widely implemented in demanding industries such as networking, telecommunications, computing, military, aerospace, transportation, and broadcasting, finding applications in satellite and space exploration, military and aerospace systems, radar and surveillance, advanced telecommunications, transportation electronics, and high-end computer applications like CPUs, MCMs, and ASICs.

Product Attributes

  • Brand: Bel / Cinch Connectivity Solutions
  • Technology: CIN::APSE Solderless Compression Interconnect
  • Certifications: RoHS and REACH compliant
  • Contact Material: Molybdenum with 20 - 30in. gold plating
  • Insulator Housing Materials: Liquid Crystal Polymer / Polyetherimide / Composites / Ceramics
  • Packaging Material: Anti-static ABS (example)
  • Contact Configurations: Contact Only, Plunger - Contact, Plunger - Contact - Plunger, Contact - Spacer - Contact
  • EMI Protection: Yes
  • IP Rating: Yes

Technical Specifications

SpecificationDetails
Signal Speed50+ Gbps
Contact Diameters0.020 (0.5mm) and 0.039 (1.0mm)
Standard Pitch0.039 (1.0mm) or greater
Maximum I/O Count (Implemented)7,396 I/Os
Contact Resistance< 15 m (at ~2 oz. / 0.55 N compression force)
Current-Carrying Capacity6.5 Amp (on 0.5mm contact, 30C temperature rise)
Inductance< 0.75 nH (Up to 3.05 GHz)
Insulation Resistance> 50,000 M (at 100 VDC)
Dielectric Withstanding250 VDC (No breakdown)
Vibration Resistance5.4 Gs; 10 - 500Hz; no discontinuity > 2 nanoseconds
Shock Resistance50 Gs; 11 milliseconds; no discontinuity > 2 nanoseconds
Temperature Life1,000 hours @ 105C (<5% resistance change)
Thermal Shock100 cycles -30C to +100C (<5% resistance change)
Humidity1,000 hours @ 25C to 65C, 85% RH (<20% resistance change)
Outgassing (ASTM E595)1.0% Total Mass Loss (TML), 0.1% CVCM
Operating Temperature (Stacking Connectors)-55 to 125C
Durability (Stacking Connectors)> 100 mating cycles
Stacking Connector Heights0.125 (3.18mm), 0.250 (6.35mm), 0.277 (7.04mm)
Stacking Connector Positions25, 51, 83, 166, 249
Stacking Connector Rows2, 5
Stacking Connector FastenersThru Holes (#2, #4), Tapped Inserts (#2-56)
Stacking Jumper Thickness0.008 (0.203mm)
Stacking Jumper Length3.0 (76.2mm)
Stacking Jumper Width (25 pos)1.10 (27.94mm)
Stacking Jumper Width (51 pos)1.75 (44.45mm)

2311150402_CINCH-3180299352_C17423165.pdf

Quality solderless compression interconnect CINCH 3180299352 designed for easy installation and maintenance for sale
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