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hanxia HX TF PUSH

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Delivery Time :	1工作日
Model Number :	HX TF PUSH
Brand Name :	HX TF PUSH
Price :	¥0.4011 (10 - 99); ¥0.3171 (100 - 299); ¥0.2752 (300 - 999); ¥0.2333 (1000 - 4999); ¥0.2082 (5000 - 9999); ¥0.1956 (10000+)

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Product Details
Company Profile

hanxia HX TF PUSH

Product Overview

This product specification defines the product performance and the test methods to ascertain the performance of the T-FLASH card holder, which is designed and manufactured by Shenzhen Hanxia Electronic Co., Ltd. This product specification defines the characteristics and test methods of the T-FLASH card connector products designed and produced by our company.

Brand Shenzhen Hanxia Electronic Co., Ltd.

Origin China

Product Name T-Flash Card Holder

Part Number HX TF PUSH

Material Compliance RoHS

Packaging Tray or Carrier Tape (as per purchase order), Reel Packaging

Storage Temperature -20~+70

Storage Humidity 80% Relative Humidity

Item	Requirements	Test Methods
1. Confirmation of Product
2. Contact resistance (Low Level)	100 m Max. initial	Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max.
3. Insulation resistance	1000 M Min.	Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (500 V DC10%).
4. Dielectric Strength	Connector must withstand test potential of 500 V AC for 1 minute. Current leakage must be 1.0 mA max.	Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 301.
5. Durability (Repeated Mating/Unmating)	Contact Resistance: 100 m Max. after testing	Mate and unmate connector for 5000 cycle.
6. Temperature rise	30C Max.	Carry rated current load. 0.3A per contact. (UL498)
7. Vibration Sinusoidal Low Frequency	No electrical discontinuity greater then 1 sec (s) shall occur. Contact resistance: 100 m max.	Subject mated connector to 10-55-10 Hz traversed in 1 minute at 1.5 mm amplitude 2 hours each of 3 mutually perpendicular plane, 10 mA applied MIL-STD-202, Method 201.
8. Shock	No electrical discontinuity greater than 1 sec. shall occur. No damage to product.	Applying an appropriate holder is allowed in vibration test and shock test. MIL-STD-202, Method 213, 490m/s2, 3 axes.
9. Thermal shock	No damage, Contact Resistance (Low Level) (Final) 100 m max.	Temperature range from -55C to +85C. Start from -55C. After 30 min. change to +85C, change time is no more than 30 seconds. Total 5 cycles. MIL-STD-202, Method 107D, condition A.
10. Humidity	No damage, Contact Resistance (Low Level) (Final) 100 m max.. Dielectric Strength should be OK, Insulation Resistance should be 100 M min.	Temperature :402C 96 hours. Relative humidity: 90-95%; Duration: 96 Hours. MIL-STD-202, Method 103.
11. Solderability	Appearance of the specimen shall be inspected after the test with the assistance of a magnifier capable of giving a magnification of 10 X for any damage such as pinholes, void or rough surface.	Soldering time: 3 to 5 Seconds Temperature: 2555C.
12. Resistance to soldering heat	No damage	Leave subject product in the 2555C chamber for 2 minutes.
13. Salt Spray	Contact Resistance (Low Level) (Final) 100 m max.	51% salt concentration 244 hours 35 2C MIL-STD-202, Method 101 Condition B.
14. High temperature	Contact resistance: 100 m max.	Subject product to 852C for 96 hours continuously. MIL-STD-202, Method 108.

Parameter	Reference Specification
Average temperature gradient in preheating	2.5C/s
Soak time tsoak	2-3 minutes
Time above 217C t1	60 s
Time above 230C t2	50 s
Time above 255C t3	5 s
Peak temperature in reflow Tpeak	255C (+5/-0C)
Temperature gradient in cooling	Max -5C/s

hanxia HX TF PUSH

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