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TE Connectivity 1658670-1

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TE Connectivity 1658670-1

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Delivery Time :	1工作日
Model Number :	1658670-1
Brand Name :	1658670-1

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TE Connectivity 1658670-1

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This document outlines specifications for a tin-lead plated area, detailing requirements for bright tin-lead plate area over nickel (Ni) or copper (Cu) substrates. It specifies minimum thickness requirements for the tin-lead layer and underlying nickel plating, along with localized plate area requirements.

Material Tin-Lead Plate

Substrate Nickel (Ni) or Copper (Cu)

Specification	Min Thickness (in)	Min Thickness (m)
Bright Tin-Lead Plate Area Over Nickel (Ni)	150	3.81
Bright Tin-Lead Plate Area Over Copper (Cu)	150	3.81
Nickel Underplate (for Tin-Lead Plate)	100 (localized)	2.54 (localized)
Localized Tin-Lead Plate Area Over 0.00130" Min Nickel	150	3.81
Localized Tin-Lead Plate Area Over 0.00094" Min Nickel	120	3.05
Localized Tin-Lead Plate Area Over 0.00071" Min Nickel	100	2.54

Specification	Min Thickness (in)	Min Thickness (m)
INSULATION TRANSGE: 1.50 [0.059] DA	150	3.81
INSULATION TRANSGE: 2.33 [0.094] DA	233	5.92

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