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SHETIME MIS22-S1F1-2000-A

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SHETIME MIS22-S1F1-2000-A

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Delivery Time :	3-5 working days
Model Number :	MIS22-S1F1-2000-A
Brand Name :	SHETIME

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SHETIME MIS22-S1F1-2000-A

Product Overview

This specification covers performance, tests, and quality requirements for SIM Memory Card Connectors. These connectors provide space savings and improved functionality for system signal transfer.

Applications: SIM Card Connectors

Brand DONGGUAN GAOYUEDA ELECTRONICS CO.,LTD

Customer P/N FP-090012

Origin TAIWAN FACTORY:

Material - Housing LCP S475 UL 94V-0

Material - Contact C5191 (High performance copper alloy / Phosphor Bronze)

Material - Shell SUS304-H

Finish - Contact Area Gold Flash Plated on Contact Area; Gold over Nickel

Finish - Solder Tails Gold Flash Plated on Solder Tails; Gold over Nickel

Certifications UL 94V-0

Part No.	Description	Rating Current	Contact Resistance	Dielectric Withstanding	Insulation Resistance	Mating Cycle	Operating Temperature	Material - Housing	Material - Contact	Material - Shell	Finish - Contact Area	Finish - Solder Tails
MIS22-S1F1-2000-A( CD)	MICOR SIM PUSN Card Holder (6+1P with CD)	0.5A MAX.	50 m MAX	500V AC MIN.	1000 M MIN.	3000 CYCLES	-25 TO +85	LCP S475 UL 94V-0	C5191	SUS304-H	GOLD FLASH PLATED	GOLD FLASH PLATED
MIS11-S1F1-2000-A( CD)	MICOR SIM PUSN Card Holder (6P without CD)	0.5A MAX.	50 m MAX	500V AC MIN.	1000 M MIN.	3000 CYCLES	-25 TO +85	LCP S475 UL 94V-0	C5191	SUS304-H	GOLD FLASH PLATED	GOLD FLASH PLATED

Test Description	Requirement	Condition
Low-Signal Level Contact Resistance	R<100 m	Apply DC 50010% Volts between adjacent contacts of mated connectors for one minute. MIL-STD-202F, Method 302
Insulation Resistance	R>1000 M	Apply DC 50010% Volts between adjacent contacts of mated connectors for one minute. MIL-STD-202F, Method 302
Dielectric Withstanding Voltage	No discharge, flashover or breakdown.	500 V initial and 250 V final for 1 minute. MIL-STD-202F, Method 301
Retention Force	100 Gram (0.98N) minimum (per pin)	Mate connector with a suitable gauge for each pin at rate of 25 mm/min. MIL-STD-1344A, Method 2012.1
Vibration	Discontinuity 1.0 microsec. MAX	Mate dummy card and subject to Vibration conditions for 2 hours in each of 3 axes. Amplitude: 1.52 mm P-P, Frequency: 10-55-10 Hz. MIL STD 202 Method 201
Durability	5000 cycles.	The sample should be mounted in the at the rate of 25mm/min. MIL-STD-1344A, Method 2016
Solderability	Solderable area shall have minimum of 95% solder coverage.	Subject the test area of contacts into flux for 30.5 seconds and then into solder bath, controlled at 2705, for 30.5 seconds.
Salt Spray	Oxidation of not more than 5%	Subject mated/unmated connectors to 51% salt-solution concentration, 352 for 24 hours. MTL-STD-1344A, Method 1001.1
Temperature Life (Heat Aging)	A. Products in 852 96 hours, the product can still be used normally. B. Products in 2605 or eight of the reflow temperature (maximum temperature of 260), the deformation of not more than 0.08 mm.	MTL-STD-202F, Method 108A

SHETIME MIS22-S1F1-2000-A

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