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TE Connectivity 225675-E

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    Buy cheap TE Connectivity 225675-E from wholesalers
     
    Buy cheap TE Connectivity 225675-E from wholesalers
    • Buy cheap TE Connectivity 225675-E from wholesalers

    TE Connectivity 225675-E

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    Delivery Time : 25-42 weeks
    Brand Name : TE Connectivity
    Model Number : 225675-E
    • Product Details
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    TE Connectivity 225675-E

    PowerElements Connectors

    PowerElements are designed for high current sourcing and distribution on Printed Circuit Boards (PCBs). They facilitate wire-to-board connections, component assembly, and fixation, including screw locking for components like fuses and relays. Additional insulation bodies provide protection against shorts. PowerElements can also address mechanical challenges such as PCB connections within housings or between PCBs. The two-piece design allows for press-fitting from both sides, protecting the PCB from mechanical stress. A wide variety of connection options are available, including headless screws, thread nuts, through holes, blind holes, and customizable installation heights, connection surfaces, and thread/drill dimensions. Available in press-fit and Surface-Mounted Device (SMD) solder technologies, SMD PowerElements are delivered blister-packed for automated assembly.

    Product Attributes

    • Brand: PowerElements
    • Certifications: REACH conform, RoHS conform (lead content under 4%)
    • Material (Massive Pressfit Zone): CuZn39Pb3, surface tin plated

    Technical Specifications

    TechnologyProduct GroupCurrent Carrying CapabilityOperating TemperaturePCB Thickness (min.)Retention Force (IEC 60352-5)Press Fit Force (max. per pin)Solder Paste Thickness (SMD)Tightening Torque (M3)Tightening Torque (M8)
    Massive Pressfit ZoneVarious (e.g., Male thread, Female thread, Angled)approx. 10 A per pin-40C to +135C1.6 mmmin. 40 N per pinmax. 250 N per pinN/A0.5 Nm9.0 Nm
    SMD Solder TechnologySMD pin, SMD socket, SMD socket with through-hole threadup to 200 A*-40C to +155CN/AN/AN/A150 m0.5 Nm9.0 Nm

    *Current carrying capability is subject to PCB thickness, cable cross section, soldering tin used, and ambient temperature.

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