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TE Connectivity 1473149-4

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TE Connectivity 1473149-4

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Model Number :	1473149-4
Brand Name :	TE Connectivity
Delivery Time :	3-5 working days

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Product Details
Company Profile

TE Connectivity 1473149-4

Product Overview

This DDR2 SO DIMM socket is designed for right-angle module orientation with a stack height of .205 inches (5.2 mm). It features 200 positions and is suitable for various circuit applications, adhering to industry standards.

Brand

Product Type

SO DIMM Socket

DRAM Type

Double Data Rate (DDR) 2

Stack Height

5.2 mm [.205 in]

Module Orientation

Right Angle

Number of Positions

200

UL Flammability Rating

UL 94V-0

Packaging Quantity

Packaging Method

Semi-Hard Tray Assembly, Tray

Ejector Location

Both Ends

Latch Material

Stainless Steel

Latch Plating Material

Tin

Module Key Type

SGRAM Locking

Ejector Type

Standard

Connector Profile

Standard Keying

Memory Socket Type

Memory Card

PCB Contact Termination Area Plating Material

Gold Flash

Contact Base Material

Copper Alloy

Contact Current Rating (Max)

Contact Mating Area Plating Material

Gold Flash

Insertion Style

Cam-In

Termination Method to Printed Circuit Board

Surface Mount

PCB Mount Retention Type

Solder Peg

Connector Mounting Type

Board Mount

Housing Material

High Temperature Thermoplastic

Housing Color

Black

Centerline (Pitch)

0.6 mm [.024 in]

Row-to-Row Spacing

6.2 mm [.244 in]

Operating Temperature Range

-55 - 85 C [-67 - 185 F]

DRAM Voltage

1.8V

Number of Bays

Number of Keys

Number of Rows

Product Compliance

Compliant

EU RoHS Directive

2011/65/EU Compliant

EU ELV Directive

2000/53/EC Compliant

China RoHS 2 Directive

MIIT Order No 32, 2016 No Restricted Materials Above Threshold

EU REACH Regulation

EC No. 1907/2006 Current ECHA Candidate List: JAN 2024 (240), Candidate List Declared Against: JUNE 2023 (235), Does not contain REACH SVHC

Halogen Content

Low Halogen - Br, Cl, F, | < 900 ppm per homogenous material. Also BFR/CFR/PVC Free

Solder Process Capability

Reflow solder capable to 260C

Specifications

Part Number	1473149-4
DRAM Type	Double Data Rate (DDR) 2
Stack Height	5.2 mm [.205 in]
Module Orientation	Right Angle
Number of Positions	200
Centerline (Pitch)	0.6 mm [.024 in]
Connector System	Cable-to-Board
Terminates To Printed Circuit Board	Printed Circuit Board
Number of Bays	2
Number of Keys	1
Number of Rows	2
Housing Material	High Temperature Thermoplastic
Housing Color	Black
Operating Temperature Range	-55 - 85 C [-67 - 185 F]
DRAM Voltage	1.8V
UL Flammability Rating	UL 94V-0
Packaging Quantity	20
Packaging Method	Semi-Hard Tray Assembly, Tray
Ejector Location	Both Ends
Latch Material	Stainless Steel
Latch Plating Material	Tin
Module Key Type	SGRAM Locking
Ejector Type	Standard
Connector Profile	Standard Keying
Memory Socket Type	Memory Card
PCB Contact Termination Area Plating Material	Gold Flash
Contact Base Material	Copper Alloy
Contact Current Rating (Max)	5A
Contact Mating Area Plating Material	Gold Flash
Insertion Style	Cam-In
Termination Method to Printed Circuit Board	Surface Mount
PCB Mount Retention Type	Solder Peg
Connector Mounting Type	Board Mount
Row-to-Row Spacing	6.2 mm [.244 in]
Product Compliance	Compliant
EU RoHS Directive	2011/65/EU Compliant
EU ELV Directive	2000/53/EC Compliant
China RoHS 2 Directive	MIIT Order No 32, 2016 No Restricted Materials Above Threshold
EU REACH Regulation	EC No. 1907/2006 Current ECHA Candidate List: JAN 2024 (240), Candidate List Declared Against: JUNE 2023 (235), Does not contain REACH SVHC
Halogen Content	Low Halogen - Br, Cl, F, \| < 900 ppm per homogenous material. Also BFR/CFR/PVC Free
Solder Process Capability	Reflow solder capable to 260C

TE Connectivity 1473149-4

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